Built-in Memory. Built-in Confidence
Memory sourcing is becoming a significant risk for AI and edge innovators, with shortages and rising prices expected through 2026 and beyond. NVIDIA Jetson™ integrates validated DRAM directly on-module, eliminating the need to source, qualify, and design with external memory.
Combined with a highly optimized software stack, Jetson enables developers to do more with less—delivering higher AI inference throughput with a minimal memory footprint for leading open generative AI models.
Jetson provides a scalable platform from Orin Nano™ to AGX Thor™, offering strong performance per dollar and making it one of the most cost-effective edge AI solutions amid rising memory prices.
The result is simpler hardware design, faster development cycles, and lower total cost of ownership with built-in memory and built-in confidence to power your AI journey.
CRG Electronics offers a purpose‑built ecosystem of carrier boards, camera integrations, and thermal management solutions designed specifically to unlock the full potential of NVIDIA® Jetson Orin Nano and Orin NX modules in demanding edge AI environments.
Our compatible carrier boards from Connect Tech, AVerMedia & PCB Arts are engineered with a focus on compactness, robust I/O, and system scalability, enabling seamless deployment in size‑ and power‑constrained platforms such as compact edge devices, UAVs, and drone systems. With optimized layouts, high‑speed interfaces, and flexible expansion capabilities, these boards support multi‑sensor integration, real‑time processing, and reliable operation in dynamic field conditions.
Complementing the compute platform, CRG integrates high‑performance Embedded cameras—including solutions from leading providers such as FRAMOS and Allied Vision—ensuring superior image quality, low latency, and precise synchronization for vision‑based AI workloads. These camera solutions are carefully matched to the Jetson Orin architecture, enabling efficient data pipelines for applications such as object detection, navigation, inspection, and situational awareness in airborne and embedded systems.
To maintain consistent performance under thermally challenging conditions, CRG also delivers advanced heat sink and thermal management solutions tailored to Orin Nano and Orin NX deployments. Our designs emphasize efficient heat dissipation within compact form factors, supporting passive or active cooling strategies depending on the application envelope. This ensures sustained AI performance without thermal throttling, even in enclosed or ruggedized environments typical of drones and edge computing nodes.
Together, CRG Electronics provides a tightly integrated, production‑ready platform that reduces development complexity and accelerates time‑to‑market for customers building next‑generation AI‑enabled systems at the edge.
