Powerful AI Needs a Thermal Solution That Can Keep Up.
Heat is the biggest bottleneck in computing — and with the rise of advanced AI models, the problem is only growing. AI reasoning tasks demand sustained performance, not just quick bursts. That means more processing, more heat… and the need for next-gen thermal solutions.
Introducing AirJet® Mini G2 — the world’s thinnest and most powerful solid-state active cooling chip. Developed by Frore Systems, AirJet is a revolutionary, fully self-contained active heat sink module. AirJet Mini G2 removes 7.5 W of heat and is silent, thin, light, dust resilient, vibration free, water-resistant and outperforms fans.
Built for today’s hottest devices — from 2in1 tablets to 5G hotspots — the AirJet Mini G2 turns thermal into a strategic advantage.
Revolutionary Solid-State Cooling
Unlike fans, AirJet has no moving parts. Inside the chip, ultrasonic MEMS membranes pull in air and create high-velocity pulsating jets of air that saturate with heat.
The hot air is then ejected from the host device through an exit vent — all in a module just 2.65 mm thin.
Silent. Dustproof. Vibration-free.
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