BM57 Series

0.3mm Pitch / Stacking Height 0.6mm / Width 1.9mm, Low-Profile Hybrid FPC-to-Board Connector Supporting 5A

Features

0.3mm Pitch / Stacking Height 0.6mm / Width 1.9mm
Low-Profile Hybrid FPC-to-Board Connector Supporting 5A


1 Low-profile design with high power supply capacity
 – Rated current: 5A for power contact,
                         0.3A for signal contact
 – 0.6mm stacking height, 1.9mm width
2 Full armored design prevents housing damage
3 Easy mating operation with wide self alignment range
4 Insert molded header and receptacle design – Solder Wicking Prevention
5 Multi-point soldering enhances PCB peeling strength

 

Specifications

  • Connector Type
  • Receptacle, Header
  • Parts
  •  
  • Industry Standard
  •  
  • Safety Standards
  •  
  • Performance Characteristics
  •  
  • Transmission Rate
  •  
  • Contact Pitch
  • 0.3 mm
  • Mounting Pitch
  • 0.3 mm
  • Tab Width (mm)
  •  
  • Mated Height (Min.)
  • 0.6 mm
  • Mated Height (Max.)
  • 0.6 mm
  • Mated Height (STEP)
  • 0.6 mm
  • Number of Positions
  • 10
  • Remarks on Number of Positions
  •  
  • Floating Design
  •  
  • Mating/Unmating Cycles
  • 10
  • Mounting Style
  • SMT
  • Connector Orientation
  •  
  • Contact Plating
  • Gold
  • Rated Current
  • 5.0 A
  • Rated Voltage (AC)
  • AC 30.0 V
  • Rated Voltage (DC)
  • DC 30.0 V
  • Operating Temperature Max.
  • 85 ℃
  • Operating Temperature Min.
  • -55 ℃

Info & Data Sheet on https://www.hirose.com/en/product/document?clcode=&productname=&series=BM57&documenttype=Catalog&lang=en&documentid=en_BM57_CAT

For additional support 
YARON BLECHER –  Field Application Engineer, HIROSE  yaron@crg.co.il   +972-52-5222463   www.crg.co.il